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On the dual role of the Knudsen layer and unsteady, adiabatic expansion in pulse sputtering phenomenaKELLY, R.The Journal of chemical physics. 1990, Vol 92, Num 8, pp 5047-5056, issn 0021-9606Article

The effect of atomic-scale etch pit formation on depth resolution in sputter profilingCARTER, G; NOBES, M. J; KATARDJIEV, I. V et al.Surface and interface analysis. 1990, Vol 15, Num 7, pp 447-450, issn 0142-2421Article

Reduction of pumping time for a sputtering system by glow discharge cleaningKAGATSUME, A; UEDA, S; AKIBA, M et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1991, Vol 9, Num 4, pp 2364-2368, issn 0734-2101Article

Oxygen and CO Adsorption on Au/SiO₂ Catalysts Prepared by Magnetron Sputtering: The Role of Oxygen StorageXIAOLIN ZHENG; VEITH, Gabriel M; REDEKOP, Evgeniy et al.Industrial & engineering chemistry research. 2010, Vol 49, Num 21, pp 10428-10437, issn 0888-5885, 10 p.Conference Paper

Statistical properties of sputtering from individual atomic collision cascades in solidsHOU, M; ECKSTEIN, W.Journal of applied physics. 1992, Vol 71, Num 8, pp 3975-3980, issn 0021-8979Article

Simple planar magnetron sputtering sourceRASTOGI, R. S; VANKAR, V. D; CHOPRA, K. L et al.Review of scientific instruments. 1987, Vol 58, Num 8, pp 1505-1506, issn 0034-6748Article

Deposition error compensation for optical multilayer coatings. II: Experimental results-sputtering systemSULLIVAN, B. T; DOBROWOLSKI, J. A.Applied optics. 1993, Vol 32, Num 13, pp 2351-2360, issn 0003-6935Article

Characterization of the fluxes of neutral and positively charged clusters (Ag_n and Ag_n⁺; n≤4) produced by argon ion sputtering of silverFRANZREB, K; WUCHER, A; OECHSNER, H et al.Zeitschrift für Physik. D, atoms, molecules and clusters. 1993, Vol 26, pp S101-S103, issn 0178-7683, SUPConference Paper

The impact of the metallization technology on junction behaviorPOLIGNANO, M. L; CIRCELLI, N.Journal of applied physics. 1990, Vol 68, Num 4, pp 1869-1877, issn 0021-8979Article

A new proton-conducting porous silicon membrane for small fuel cellsPICHONAT, T; GAUTHIER-MANUEL, B; HAUDEN, D et al.Chemical engineering journal (1996). 2004, Vol 101, Num 1-3, pp 107-111, issn 1385-8947, 5 p.Conference Paper

Analysis and characterization of In-film defects generated during sputter deposition of aluminum-alloy filmsABBURI, M; PAVATE, V; CHIANG, S et al.SPIE proceedings series. 1998, pp 132-137, isbn 0-8194-2714-4Conference Paper

Nonlinear Photon Stimulated Desorption from an oxidized tungsten surfaceTAYLOR, D. P; HELVAJIAN, H.SPIE proceedings series. 1998, pp 25-33, isbn 0-8194-2713-6Conference Paper

Theory for the etching of organic materials by ultraviolet laser pulsesSAUERBREY, R; PETTIT, G. H.Applied physics letters. 1989, Vol 55, Num 5, pp 421-423, issn 0003-6951, 3 p.Article

Recent advances in sputter deposition = Progrès récents dans le dépôt par pulvérisationTHORNTON, J. A.Surface engineering. 1986, Vol 2, Num 4, pp 283-292, issn 0267-0844Article

Multiferroic properties and magnetoelectric coupling in highly textured Pb(Fe_0.5Nb_0.5)O₃ thin films obtained by RF sputteringRAYMOND, Oscar; OSTOS, Carlos; FONT, Reynaldo et al.Acta materialia. 2014, Vol 66, pp 184-191, issn 1359-6454, 8 p.Article

Wafer induced reading error in metal sputtering processKIM, Dae-Joung; OH, Seok-Hwan; YEO, Gi-Sung et al.SPIE proceedings series. 2001, pp 667-672, isbn 0-8194-4030-2Conference Paper

Gas dynamics of the pulsed emission of a perfect gas with applications to laser sputtering and to nozzle expansionKELLY, R.Physical review. A. 1992, Vol 46, Num 2, pp 860-874, issn 1050-2947Article

Practical magnetron sputtering system for the deposition of optical multilayer coatingsDOBROWOLSKI, J. A; PEKELSKY, J. R; PELLETIER, R et al.Applied optics. 1992, Vol 31, Num 19, pp 3784-3789, issn 0003-6935Article

Preparation and some properties of sputtered Co/U-As multilayersPLASKETT, T. S; FUMAGALLI, P; MCGUIRE, T. R et al.IEEE transactions on magnetics. 1992, Vol 28, Num 5, pp 2659-2661, issn 0018-9464, 2Conference Paper

An investigation of hysteresis effects as a function of pumping speed, sputtering current, and O₂/Ar ratio, in Ti-O₂ reactive sputtering processesKUSANO, E.Journal of applied physics. 1991, Vol 70, Num 11, pp 7089-7096, issn 0021-8979Article

Modeling of sputtering and redeposition in focused-ion-beam trench millingISHITANI, T; OHNISHI, T.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1991, Vol 9, Num 6, pp 3084-3089, issn 0734-2101Article

Magnetic Co/Al multilayers prepared by planar magnetron sputteringCUI, F. Z; WANG, J. F; FAN, Y. D et al.Journal of applied physics. 1991, Vol 70, Num 6, pp 3379-3381, issn 0021-8979Article

Preparation, transport properties and patterning of superconducting YBCO thin filmsKATARIA, N. D; MAY, D; WOLF, H et al.Physica. C. Superconductivity. 1991, Vol 180, Num 1-4, pp 61-64, issn 0921-4534Conference Paper

Target magnetic-field effects on deposition rate in rf magnetron sputteringFURUYA, A; HIRONO, S.Journal of applied physics. 1990, Vol 68, Num 1, pp 304-310, issn 0021-8979Article